june 1999 f dc63 8p p-channel 2.5v specified powertrench tm mosfet general description features absolute maximum ratings t a = 25c unless otherwise note symbol parameter ratings units v dss drain-source voltage -20 v v gss gate-source voltage - continuous 8 v i d drain current - continuous (note 1a) -4.5 a - pulsed -20 p d maximum power dissipation ( note 1a) 1.6 w (note 1b) 0.8 t j ,t stg operating and storage temperature range -55 to 15 0 c thermal characteristics r q ja thermal resistance, junction-to-ambient (note 1a) 78 c/w r q jc thermal resistance, junction-to-case (note 1) 30 c/w FDC638 p rev.d this p -channel 2.5v specified mosfet is produced using fairchild semiconductor 's advanced powertrench process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance . these devices are well suited for battery power applications: load switching and power management, battery charging circuits, and dc/ dc conversion. -4.5 a, -2 0 v. ?r ds(on ) = 0.045 w @ v gs = -4.5 v r ds(on ) = 0.065 w @ v gs = -2 .5 v . low gate charge (13nc typical). high performance trench technology for extremely low r ds(on) . supersot tm -6 package: small footprint (72 % smaller than s tandard so-8); l ow profile (1mm thick). soic-16 sot-23 supersot t m -8 so-8 sot-223 supersot t m -6 d d d s d g supersot -6 tm .638 pin 1 3 5 6 4 1 2 3 ?1999 fairchild semiconductor
electrical characteristics (t a = 25c unless otherwise noted) symbol parameter conditions min typ max units off characteristics bv dss drain-source breakdown voltage v gs = 0 v, i d = -250 a -20 v d bv dss / d t j breakdown voltage temp. coefficient i d = -250 a , referenced to 25 o c -18 mv/ o c i dss zero gate voltage drain current v ds = -16 v , v gs = 0 v -1 a t j = 55 o c -10 a i gssf gate - body leakage, forward v gs = 8 v, v ds = 0 v 100 na i gssr gate - body leakage, reverse v gs = -8 v, v ds = 0 v -100 na on characteristics (note 2) v gs (th) gate threshold voltage v ds = v gs , i d = -250 a -0.4 -0.9 -1.5 v d v gs(th) / d t j gate threshold voltage temp.coefficient i d = -250 a , referenced to 25 o c 3 mv/ o c r ds(on) static drain-source on-resistance v gs = -4.5 v, i d = -4 .5 a 0.039 0.045 w t j = 125 o c 0.054 0.072 v gs = -2.5 v, i d = -3.8 a 0.057 0.065 i d (on) on-state drain current v gs = -4.5 v, v ds = -5 v -20 a g fs forward transconductance v ds = -10 v, i d = -4 .5 a 6.5 s dynamic characteristics c iss input capacitance v ds = -10 v, v gs = 0 v, 1240 pf c oss output capacitance f = 1.0 mhz 270 pf c rss reverse transfer capacitance 100 pf switching ch aracteristics (note 2 ) t d(on ) turn - on delay time v dd = -5 v, i d = -1 a, 8 16 ns t r turn - on rise time v gs = -4.5 v, r gen = 6 w 15 27 ns t d(off) turn - off delay time 45 65 ns t f turn - off fall time 30 50 ns q g total gate charge v ds = -10 v, i d = -4 .5 a, 13 19 nc q gs gate-source charge v gs = -5 v 1.8 nc q gd gate-drain charge 3 nc drain-source diode characteristics i s continuous source diode current -1.3 a v sd drain-source diode forward voltage v gs = 0 v, i s = -1.3 a (note 2 ) -0.75 -1.2 v notes: 1 . r q ja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the so lder mounting surface of the drain pins. r q jc is guaranteed by design while r q ca is determined by the user's board design. a. 78 o c/w when mounted on a 1 in 2 pad of 2oz cu on fr-4 board . b . 156 o c/w when mounted on a minimum pad. 2. pulse test: pulse width < 300 s, duty cycle < 2.0%. FDC638 p rev.d
FDC638 p rev.b 0 1 2 3 4 5 0 4 8 12 16 20 -v , drain-source voltage (v) - i , drain-source current (a) v = -4.5v gs - 2.5v ds d - 2.0v -3.0v 0 5 10 15 20 0.8 1 1.2 1.4 1.6 - i , drain current (a) drain-source on-resistance v = -2.5v gs d r , normalized ds(on) -4.5v -3.0v -4.0v -3.5v typical electrical characteristics figure 1. on-region characteristics . figure 2. on-resistance variation with drain current and gate voltage . figure 3. on-resistance variation with temperature . figure 5. transfer characteristics. 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0.001 0.01 0.1 1 10 20 -v , body diode forward voltage (v) - i , reverse drain current (a) 25c -55c v = 0v gs sd s t = 125c j figure 4 . on resistance variation with gate-t o -source voltage. -50 -25 0 25 50 75 100 125 150 0.6 0.8 1 1.2 1.4 1.6 t , junction temperature (c) drain-source on-resistance v = -4.5v gs i = -4.5a d r , normalized ds(on) j 1 2 3 4 5 0 0.03 0.06 0.09 0.12 0.15 - v , gate to source voltage (v) r , on-resistance (ohm) gs ds(on) t = 125c a 25c i = -2.0a d 0 0.8 1.6 2.4 3.2 4 0 4 8 12 16 20 -v , gate to source voltage (v) - i , drain current (a) v = -5v ds gs d t = -55c j 125c 25c figure 6 . body diode forward voltage varia tion with source current and temperature.
FDC638 p rev.b figure 10 . single pulse maximum power dissipation. 0.1 0.3 1 3 10 20 50 100 200 400 1000 2500 -v , drain to source voltage (v) capacitance (pf) ds c iss f = 1 mhz v = 0 v gs c oss c rss figure 8. capacitance characteristics . figure 7 . gate charge characteristics. figure 9. maximum safe operating area. typical electrical characteristics 0 3 6 9 12 15 0 1 2 3 4 5 q , gate charge (nc) -v , gate-source voltage (v) g gs v = -5v ds -10v i = -4.5a d -15v 0.1 0.2 0.5 1 2 5 10 30 0.01 0.05 0.3 1 5 30 - v , drain-source voltage (v) - i , drain current (a) rds(on) limit d a dc ds 1s 100ms 10ms 1ms v = -4.5v single pulse r =156 c/w t = 25c q ja gs a 100us 0.01 0.1 1 10 100 300 0 1 2 3 4 5 single pulse time (sec) power (w) single pulse r =156c/w t = 25c q ja a 0.00001 0.0001 0.001 0.01 0.1 1 10 100 300 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 t , time (sec) transient thermal resistance r(t), normalized effective 1 single pulse d = 0.5 0.1 0.05 0.02 0.01 0.2 duty cycle, d = t / t 1 2 r (t) = r(t) * r r = 156c/w t - t = p * r (t) a j p(pk) t 1 t 2 q ja q ja q ja q ja figure 11 . transient thermal response curve . thermal characterization performed using the conditions described in n ote 1b. transient thermal response will change depending on the circuit board design.
trademarks acex? coolfet? crossvolt? e 2 cmos tm fact? fact quiet series? fast ? fastr? gto? hisec? the following are registered and unregistered trademarks fairchild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. life support policy fairchilds products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: isoplanar? microwire? pop? powertrench? qs? quiet series? supersot?-3 supersot?-6 supersot?-8 tinylogic? 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms datasheet identification product status definition advance information preliminary no identification needed obsolete this datasheet contains the design specifications for product development. specifications may change in any manner without notice. this datasheet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains final specifications. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only. formative or in design first production full production not in production disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. uhc? vcx?
1998 fairchild semiconductor corporation embossed carrier tape ssot-6 packaging configuration: fi g ur e 1.0 comp onent s lead er tape 500mm mi nimum or 125 emp t y poc kets traile r tap e 300mm mi nimum or 75 empt y poc kets ssot-6 tape leader and trailer configuration: fi g ur e 2.0 cover tape carrier tape note/comments no markin g required packaging option ssot-6 packaging information stan da rd (no f l ow c ode ) l9 9z d87z packaging type reel size tnr 7" di a tnr 7" di a tnr 13" qty per reel/tube/bag 3,000 3,000 10,000 box dimension (mm) 184x 187x 47 184x 187x 47 343x 343x 64 max qty per box 9,000 9,000 30,000 weight per unit (gm) 0.0158 0.0158 0.0158 weight per reel (kg) 0.1440 0.1440 0.4700 f63tnr label customize label antistatic cover tape 184mm x 187mm x 47mm pizza box fo r standar d option f63tnr label f63tnr label f63tnr label sampl e 343mm x 342mm x 64mm intermediate box fo r d87z option f63tnr label ssot-6 unit orientation 631 631 631 631 631 pin 1 lot: cbvk741b019 fsid: fdc633n d/c1: d9842 qty1: spec rev: spec: qty: 3000 d/c2: qty2: cpn: n/f: f (f63tnr)3 packaging description: ssot-6 parts are shipped in tape. the carrier tape is made fro m a di ss i pat i ve (c arbo n fi l led) po ly carb on ate resin. the cover tape is a multilayer film (heat activated adhesive in nature) primarily composed of polyester film , ad he si ve l ay er, s ealant, an d anti-s tatic sp rayed . these reeled parts in standard option are shipped w ith 3,000 u ni ts p er 7" or 177cm di ameter reel . th e reel s are dark blue in color and is made of polystyrene plastic (anti- static coated). other option comes in 10,000 units per 13" or 330cm di am eter reel . thi s and s ome ot he r o pti on s are described in the packaging info rmation table. th es e fu ll reels are in di vi du al l y ba rc od e la be l ed a nd pl aced in si de a pi zza b ox (il l us trated in figure 1.0) made of recyclable corr ugated brown paper with a fairchild logo pr i nti ng .. o ne p i zza bo x co nt ain s th ree reels maxi mu m. an d t hese pi zza b oxes are pl ac ed i ns id e a ba rco de labeled shipping box whic h comes in d if ferent sizes de pe nd ing o n th e n umb er of par ts sh i pp ed. agent. supersot tm -6 tape and reel data and package dimensions july 1999, rev. c
p1 a0 d1 p0 f w e1 d0 e2 b0 tc wc k0 t dimensions are in inches and millimeters tape size reel option dim a dim b dim c dim d dim n dim w1 dim w2 dim w3 (lsl-usl) 8mm 7" dia 7.00 177.8 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 2.165 55 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 0.429 7.9 ?10.9 8mm 13" dia 13.00 330 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 4.00 100 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 0.429 7.9 ?10.9 see detail aa dim a max 13" diameter option 7" diameter option dim a max see detail aa w3 w2 max measured at hub w1 measured at hub dim n dim d min dim c b min detail aa notes: a0, b0, and k0 dimensions are determined with respect to the eia/jedec rs-481 rotational and lateral movement requirements (see sketches a, b, and c). 20 deg maximum component rotation 0.5mm maximum 0.5mm maximum sketch c (top view) component lateral movement typical component cavity center line 20 deg maximum typical component center line b0 a0 sketch b (top view) component rotation sketch a (side or front sectional view) component rotation user direction of feed ssot-6 embossed carrier tape configuration: fi g ure 3.0 ssot-6 reel configuration: fi g ure 4.0 dimensions are in millimeter pkg type a0 b0 w d0 d1 e1 e2 f p1 p0 k0 t wc tc ssot-6 (8mm) 3.23 +/-0.10 3.18 +/-0.10 8.0 +/-0.3 1.55 +/-0.05 1.125 +/-0.125 1.75 +/-0.10 6.25 min 3.50 +/-0.05 4.0 +/-0.1 4.0 +/-0.1 1.37 +/-0.10 0.255 +/-0.150 5.2 +/-0.3 0.06 +/-0.02 supersot tm -6 tape and reel data and package dimensions, continued july 1999, rev. c
? 1998 fairchild semiconductor corporation supersot ? -6 (fs pkg code 31, 33) 1 : 1 scale 1:1 on letter size paper dimensions shown below are in: inches [ m ill imeters ] part weight per unit (gram): 0.0158 supersot tm -6 tape and reel data and package dimensions, continued september 1998, rev. a
trademarks acex? coolfet? crossvolt? e 2 cmos tm fact? fact quiet series? fast ? fastr? gto? hisec? the following are registered and unregistered trademarks fairchild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. life support policy fairchilds products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: isoplanar? microwire? pop? powertrench? qs? quiet series? supersot?-3 supersot?-6 supersot?-8 tinylogic? 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms datasheet identification product status definition advance information preliminary no identification needed obsolete this datasheet contains the design specifications for product development. specifications may change in any manner without notice. this datasheet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains final specifications. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only. formative or in design first production full production not in production disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. uhc? vcx?
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